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| author | Greg Kroah-Hartman <gregkh@linuxfoundation.org> | 2020-03-20 13:45:25 +0100 |
|---|---|---|
| committer | Greg Kroah-Hartman <gregkh@linuxfoundation.org> | 2020-03-20 13:45:25 +0100 |
| commit | c23ff2aa3e783c7a2fffd2dd40cd686b8f597da8 (patch) | |
| tree | daf07189948a6701eeee91e7792c78526de9f006 /scripts/patch-kernel | |
| parent | MAINTAINERS: Add entry for MHI bus (diff) | |
| parent | interconnect: qcom: Add OSM L3 support on SC7180 (diff) | |
| download | linux-c23ff2aa3e783c7a2fffd2dd40cd686b8f597da8.tar.gz linux-c23ff2aa3e783c7a2fffd2dd40cd686b8f597da8.zip | |
Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into char-misc-next
Georgi writes:
interconnect changes for 5.7
Here is a pull request with interconnect changes for the 5.7-rc1 merge
window. It contains just driver updates, and these are:
- Refactoring of the SDM845 driver, which is now improved to better
represent the hardware.
- New driver for SC7180 platforms.
- New driver for OSM L3 interconnect hardware found on SDM845/SC7180
platforms.
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux:
interconnect: qcom: Add OSM L3 support on SC7180
dt-bindings: interconnect: Add OSM L3 DT binding on SC7180
interconnect: qcom: Add OSM L3 interconnect provider support
dt-bindings: interconnect: Add OSM L3 DT bindings
interconnect: qcom: Allow icc node to be used across icc providers
interconnect: qcom: Add SC7180 interconnect provider driver
dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings
interconnect: qcom: sdm845: Split qnodes into their respective NoCs
interconnect: qcom: Consolidate interconnect RPMh support
dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings
dt-bindings: interconnect: Add YAML schemas for QCOM bcm-voter
dt-bindings: interconnect: Convert qcom,sdm845 to DT schema
Diffstat (limited to 'scripts/patch-kernel')
0 files changed, 0 insertions, 0 deletions
