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2025-09-12Merge branch 'icc-glymur' into icc-nextGeorgi Djakov1-0/+172
Add interconnect dt-bindings and driver support for Qualcomm's next gen compute SoC - Glymur. * icc-glymur dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Glymur SoC interconnect: qcom: icc-rpmh: increase MAX_PORTS to support four QoS ports interconnect: qcom: add glymur interconnect provider driver Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-0-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-09-12dt-bindings: interconnect: Add OSM L3 compatible for QCS615 SoCRaviteja Laggyshetty1-0/+5
Add Operation State Manager (OSM) L3 interconnect provider binding for QCS615 SoC. As the OSM hardware in QCS615 and SM8150 are same, added a family-level compatible for SM8150 SoC. Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250819-talos-l3-icc-v3-1-04529e85dac7@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-08-15dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty1-0/+172
Glymur SoC Document the RPMh Network-On-Chip Interconnect in Glymur platform. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-1-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-29Merge tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/socLinus Torvalds1-3/+8
Pull SoC devicetree updates from Arnd Bergmann: "There are a few new variants of existing chips: - mt6572 is an older mobile phone chip from mediatek that was extremely popular a decade ago but never got upstreamed until now - exynos2200 is a recent high-end mobile phone chip used in a few Samsung phones like the Galaxy S22 - Renesas R-Car V4M-7 (R8A779H2) is an updated version of R-Car V4M (R8A779H0) and used in automotive applications - Tegra264 is a new chip from NVIDIA, but support is fairly minimal for now, and not much information is public about it There are five more chips in a separate branch, as those are new chip families that I merged along with the necessary infrastructure. New board support is not that exciting, with a total of 33 newly added machines here: - Evaluation platforms for the chips above, plus TI am62d2 and Sophgo sg2042 - Six 32-bit industrial boards based on stm32, imx6 and am33 chips, plus eight 64-bit rockchips rk33xx/rk35xx, am62d2, t527, imx8 and imx95 - Two newly added ASPEED BMC based motherboards, and one that got removed - Phones and Tablets based on 32-bit mt6572, tegra30 and 64-bit msm8976 SoCs - Three Laptops based on Mediatek mt8186 and Qualcomm Snapdragon X1 - A set-top box based on Amlogic meson-gxm Updates for existing machines are spread over all the above families. One notable change here is support for the RP1 I/O chip used in Raspberry Pi 5" * tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (606 commits) riscv: dts: sophgo: fix mdio node name for CV180X riscv: dts: sophgo: sophgo-srd3-10: reserve uart0 device riscv: dts: sophgo: add Sophgo SG2042_EVB_V2.0 board device tree riscv: dts: sophgo: add Sophgo SG2042_EVB_V1.X board device tree dt-bindings: riscv: add Sophgo SG2042_EVB_V1.X/V2.0 bindings riscv: dts: sophgo: add ethernet GMAC device for sg2042 riscv: dts: sophgo: Enable ethernet device for Huashan Pi riscv: dts: sophgo: Add mdio multiplexer device for cv18xx riscv: dts: sophgo: Add ethernet device for cv18xx riscv: dts: sophgo: sg2044: add pmu configuration riscv: dts: sophgo: sg2044: add ziccrse extension riscv: dts: sophgo: add zfh for sg2042 riscv: dts: sophgo: add ziccrse for sg2042 riscv: dts: sophgo: Add xtheadvector to the sg2042 devicetree riscv: dts: sophgo: sg2044: add PCIe device support for SG2044 riscv: dts: sophgo: sg2044: add MSI device support for SG2044 riscv: dts: sophgo: add reset configuration for Sophgo CV1800 series SoC riscv: dts: sophgo: add reset generator for Sophgo CV1800 series SoC dt-bindings: soc: sophgo: Move SoCs/boards from riscv into soc, add SG2000 riscv: dts: sophgo: sg2044: Add missing riscv,cbop-block-size property ...
2025-07-22Merge branch 'icc-milos' into icc-nextGeorgi Djakov1-0/+136
Add documentation and driver for the interconnect on the Milos SoC. * icc-milos dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC interconnect: qcom: Add Milos interconnect provider driver Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-0-c446203c3b3a@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-21dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Luca Weiss1-0/+136
Qualcomm Milos SoC Document the RPMh Network-On-Chip Interconnect of the Milos (e.g. SM7635) SoC. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-1-c446203c3b3a@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: qcom,msm8998-bwmon: Allow 'nonposted-mmio'Konrad Dybcio1-0/+2
One of the BWMON instances on SM8750 requires that its MMIO space is mapped specifically with the nE memory attribute. Allow the nonposted-mmio property which instructs the OS to do so. Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250716-8750_cpubwmon-v4-1-12212098e90f@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoCRaviteja Laggyshetty1-0/+5
Add Epoch Subsystem (EPSS) L3 interconnect provider binding for QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same, added a family-level compatible for SA877P SoC. This shared fallback compatible allows grouping of SoCs with similar hardware, reducing the need to explicitly list each variant in the driver match table. Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250711102540.143-2-raviteja.laggyshetty@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18dt-bindings: interconnect: qcom: Remove double colon from descriptionLuca Weiss10-10/+10
No double colon is necessary in the description. Fix it for all bindings so future bindings won't have the same copy-paste mistake. Reported-by: Rob Herring <robh@kernel.org> Closes: https://lore.kernel.org/lkml/20250625150458.GA1182597-robh@kernel.org/ Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250717-bindings-double-colon-v1-2-c04abc180fcd@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-07dt-bindings: interconnect: add mt7988-cci compatibleFrank Wunderlich1-3/+8
Add compatible for Mediatek MT7988 SoC with mediatek,mt8183-cci fallback which is taken by driver. Signed-off-by: Frank Wunderlich <frank-w@public-files.de> Acked-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20250706132213.20412-8-linux@fw-web.de Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
2025-05-19Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov1-0/+1
Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs. Current interconnect framework is based on static IDs for creating node and registering with framework. This becomes a limitation for topologies where there are multiple instances of same interconnect provider. Modified interconnect framework APIs to create and link icc node with dynamic IDs, this will help to overcome the dependency on static IDs. * icc-sa8775p dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P interconnect: core: Add dynamic id allocation support interconnect: qcom: Add multidev EPSS L3 support interconnect: qcom: icc-rpmh: Add dynamic icc node id support interconnect: qcom: sa8775p: Add dynamic icc node id support Link: https://lore.kernel.org/r/20250415095343.32125-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-28dt-bindings: interconnect: Correct indentation and style in DTS exampleKrzysztof Kozlowski6-52/+52
DTS example in the bindings should be indented with 2- or 4-spaces and aligned with opening '- |', so correct any differences like 3-spaces or mixtures 2- and 4-spaces in one binding. While re-indenting, drop unused labels. No functional changes here, but saves some comments during reviews of new patches built on existing code. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org> Link: https://lore.kernel.org/r/20250324125302.82167-1-krzysztof.kozlowski@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-15dt-bindings: interconnect: Add EPSS L3 compatible for SA8775PRaviteja Laggyshetty1-0/+1
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SA8775P SoCs. The L3 instance on the SA8775P SoC is similar to those on SoCs like SM8250 and SC7280. These SoCs use the PERF register instead of L3_REG for programming the performance level, which is managed in the data associated with the target-specific compatibles. Since the hardware remains the same across all EPSS-supporting SoCs, the generic compatible is retained for all SoCs. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20250415095343.32125-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14Merge branch 'icc-sm8750' into icc-nextGeorgi Djakov1-0/+136
Add interconnect support for SM8750 SoC. The Qualcomm Technologies, Inc. SM8750 SoC is the latest in the line of consumer mobile device SoCs. * icc-sm8750 dt-bindings: interconnect: add interconnect bindings for SM8750 interconnect: qcom: Add interconnect provider driver for SM8750 interconnect: sm8750: Add missing const to static qcom_icc_desc Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-0-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM8750 CPU BWMONsShivnandan Kumar1-0/+1
Document the SM8750 BWMONs, which has one instance per cluster of BWMONv4. Signed-off-by: Shivnandan Kumar <quic_kshivnan@quicinc.com> Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Link: https://lore.kernel.org/r/20250113-sm8750_bwmon_master-v1-1-f082da3a3308@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13dt-bindings: interconnect: OSM L3: Document sm8650 OSM L3 compatibleNeil Armstrong1-0/+1
Document the OSM L3 found in the Qualcomm SM8650 platform. Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250110-topic-sm8650-ddr-bw-scaling-v1-1-041d836b084c@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13dt-bindings: interconnect: qcom-bwmon: Document QCS615 bwmon compatiblesLijuan Gao1-0/+2
Document QCS615 BWMONs, which includes one BWMONv4 instance for CPU to LLCC path bandwidth monitoring and one BWMONv5 instance for LLCC to DDR path bandwidth monitoring. Signed-off-by: Lijuan Gao <quic_lijuang@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20241218-add_bwmon_support_for_qcs615-v1-1-680d798a19e5@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-12-17dt-bindings: interconnect: add interconnect bindings for SM8750Raviteja Laggyshetty1-0/+136
Add interconnect device bindings. These devices can be used to describe any RPMh and NoC based interconnect devices. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-sar2130p' into icc-nextGeorgi Djakov1-0/+117
Add driver for the network of connects present on the SAR2130P platform. * icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC interconnect: qcom: add support for SAR2130P Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-qcs615' into icc-nextGeorgi Djakov1-0/+73
Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC. * icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC interconnect: qcom: add QCS615 interconnect provider driver Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-qcs8300' into icc-nextGeorgi Djakov1-0/+72
Add interconnect support for QCS8300 SoC * icc-qcs8300 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC interconnect: qcom: add QCS8300 interconnect provider driver Link: https://lore.kernel.org/r/20240910101013.3020-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: qcom-bwmon: Document QCS8300 bwmon compatiblesJingyi Wang1-0/+2
Document QCS8300 BWMONs, which has two BWMONv4 instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR path. Signed-off-by: Jingyi Wang <quic_jingyw@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Link: https://lore.kernel.org/r/20240925-qcs8300_bwmon_binding-v1-1-a7bfd94b2854@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: qcom: document SAR2130P NoCDmitry Baryshkov1-0/+117
Add bindings for the Network of Connects (NoC) present on the Qualcomm SAR2130P platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty1-0/+73
QCS615 SoC Document the RPMh Network-On-Chip Interconnect of the QCS615 platform. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in ↵Raviteja Laggyshetty1-0/+72
QCS8300 SoC Document the RPMh Network-On-Chip Interconnect of the QCS8300 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-09-06Merge tag 'icc-6.12-rc1' of ↵Greg Kroah-Hartman4-14/+21
ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc into char-misc-next Georgi writes: interconnect changes for 6.12 This pull request contains the interconnect changes for the 6.12-rc1 merge window. It contains new drivers and fixes with the following highlights: Driver changes: - New driver for MSM8976 platforms - New driver for MSM8937 platforms - Enable sync_state for SM8250 platforms - Enable QoS support for QCS404 - Add ab_coeff bandwidth adjustments for MSM8953 - Drop the unsupported yet DISP nodes on SM8350 platforms - Fix missed num_nodes initialization in icc-clk driver - Misc DT and documentation fixes Signed-off-by: Georgi Djakov <djakov@kernel.org> * tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc: dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description interconnect: qcom: msm8953: Add ab_coeff dt-bindings: interconnect: qcom: msm8939: Fix example interconnect: qcom: qcs404: Add regmaps and more bus descriptions interconnect: qcom: qcs404: Mark AP-owned nodes as such interconnect: qcom: Add MSM8937 interconnect provider driver interconnect: qcom: sm8250: Enable sync_state dt-bindings: interconnect: qcom,sm8350: drop DISP nodes interconnect: qcom: sm8350: drop DISP nodes dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC interconnect: qcom: Add MSM8976 interconnect provider driver dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC interconnect: icc-clk: Add missed num_nodes initialization dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
2024-08-26Merge branch 'icc-misc' into icc-nextGeorgi Djakov2-13/+15
This series introduce new ICC drivers for some legacy socs while at it also updates a bit of qcs404 driver which seems to not receive much attention lately. * icc-misc dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC interconnect: qcom: Add MSM8976 interconnect provider driver dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC interconnect: qcom: Add MSM8937 interconnect provider driver interconnect: qcom: qcs404: Mark AP-owned nodes as such interconnect: qcom: qcs404: Add regmaps and more bus descriptions dt-bindings: interconnect: qcom: msm8939: Fix example interconnect: qcom: msm8953: Add ab_coeff dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description Link: https://lore.kernel.org/all/20240709102728.15349-1-a39.skl@gmail.com/ Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCsGeorgi Djakov1-0/+3
The virtual interconnect providers do not have their own IO address space, but this is not documented in the DT schema and the following warnings are reported by dtbs_check: sc8180x-lenovo-flex-5g.dtb: interconnect-camnoc-virt: 'reg' is a required property sc8180x-lenovo-flex-5g.dtb: interconnect-mc-virt: 'reg' is a required property sc8180x-lenovo-flex-5g.dtb: interconnect-qup-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-camnoc-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-mc-virt: 'reg' is a required property sc8180x-primus.dtb: interconnect-qup-virt: 'reg' is a required property Fix this by adding them to the list of compatibles that do not require the reg property. Link: https://lore.kernel.org/r/20240730141016.1142608-1-djakov@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatiblesTengfei Fan1-0/+2
Document the compatibles used to describe the bwmons present on the SA8775p platform. Signed-off-by: Tengfei Fan <quic_tengfan@quicinc.com> Link: https://lore.kernel.org/r/20240730-add_sa8775p_bwmon-v1-1-f4f878da29ae@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in descriptionAdam Skladowski1-2/+1
"See also" in description seems to be wrongly defined, make it inline with other yamls. Fixes: 791ed23f735b ("dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC") Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Acked-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-10-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24dt-bindings: interconnect: qcom: msm8939: Fix exampleAdam Skladowski1-6/+0
For now example list snoc_mm as children of bimc which is obviously not valid, drop bimc and move snoc_mm into snoc. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/20240709102728.15349-8-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoCAdam Skladowski1-2/+6
Add bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-4-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoCAdam Skladowski1-5/+10
Add bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://lore.kernel.org/r/20240709102728.15349-2-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnocRayyan Ansari1-1/+1
The sm8150 camnoc interconnect was mistakenly documented as "qcom,sm8150-camnoc-noc", for which there is no reference to in drivers or device tree. Correct this to "qcom,sm8150-camnoc-virt". Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org> Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240716144738.109823-1-rayyan.ansari@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-29dt-bindings: Batch-update Konrad Dybcio's emailKonrad Dybcio3-3/+3
Use my @kernel.org address everywhere. Signed-off-by: Konrad Dybcio <konradybcio@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240726-topic-konrad_email-v1-3-f94665da2919@kernel.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-19Merge tag 'char-misc-6.11-rc1' of ↵Linus Torvalds3-0/+205
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char / misc and other driver updates from Greg KH: "Here is the "big" set of char/misc and other driver subsystem changes for 6.11-rc1. Nothing major in here, just loads of new drivers and updates. Included in here are: - IIO api updates and new drivers added - wait_interruptable_timeout() api cleanups for some drivers - MODULE_DESCRIPTION() additions for loads of drivers - parport out-of-bounds fix - interconnect driver updates and additions - mhi driver updates and additions - w1 driver fixes - binder speedups and fixes - eeprom driver updates - coresight driver updates - counter driver update - new misc driver additions - other minor api updates All of these, EXCEPT for the final Kconfig build fix for 32bit systems, have been in linux-next for a while with no reported issues. The Kconfig fixup went in 29 hours ago, so might have missed the latest linux-next, but was acked by everyone involved" * tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits) misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems misc: delete Makefile.rej binder: fix hang of unregistered readers misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI virtio: add missing MODULE_DESCRIPTION() macro agp: uninorth: add missing MODULE_DESCRIPTION() macro spmi: add missing MODULE_DESCRIPTION() macros dev/parport: fix the array out-of-bounds risk samples: configfs: add missing MODULE_DESCRIPTION() macro misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver misc: keba: Fix missing AUXILIARY_BUS dependency slimbus: Fix struct and documentation alignment in stream.c MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches misc: fastrpc: use coherent pool for untranslated Compute Banks misc: fastrpc: support complete DMA pool access to the DSP misc: fastrpc: add missing MODULE_DESCRIPTION() macro misc: fastrpc: Add missing dev_err newlines misc: fastrpc: Use memdup_user() nvmem: core: Implement force_ro sysfs attribute nvmem: Use sysfs_emit() for type attribute ...
2024-07-04Merge branch 'icc-rpmh-qos' into icc-nextGeorgi Djakov1-0/+53
This series adds QoS support for QNOC type device which can be found on SC7280 platform. It adds support for programming priority, priority forward disable and urgency forwarding. This helps in priortizing the traffic originating from different interconnect masters at NOC (Network On Chip). * icc-rpmh-qos dt-bindings: interconnect: add clock property to enable QOS on SC7280 interconnect: qcom: icc-rpmh: Add QoS configuration support interconnect: qcom: sc7280: enable QoS configuration interconnect: qcom: Fix DT backwards compatibility for QoS Link: https://lore.kernel.org/r/20240607173927.26321-1-quic_okukatla@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04Merge branch 'icc-msm8953' into icc-nextGeorgi Djakov1-0/+101
Add interconnect driver for MSM8953-based devices. * icc-msm8953 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC interconnect: qcom: Add MSM8953 driver Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-28dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoCVladimir Lypak1-0/+101
Add the device-tree bindings for interconnect providers used on MSM8953 platform. Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-25dt-bindings: interconnect: qcom,msm8998-bwmon: Add X1E80100 BWMON instancesSibi Sankar1-0/+2
Document X1E80100 BWMONs, which has multiple (one per cluster) BWMONv4 instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR path. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20240624092214.146935-3-quic_sibis@quicinc.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25dt-bindings: interconnect: qcom,msm8998-bwmon: Remove opp-table from the ↵Sibi Sankar1-1/+0
required list Remove opp-table from the required list as the bindings shouldn't care where the OPP tables (referenced by the operating-points-v2 property) comes from. Suggested-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20240624092214.146935-2-quic_sibis@quicinc.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-24dt-bindings: interconnect: add clock property to enable QOS on SC7280Odelu Kukatla1-0/+53
Add clock property to enable the clocks required for accessing QoS configuration registers. Signed-off-by: Odelu Kukatla <quic_okukatla@quicinc.com> Acked-by: "Rob Herring (Arm)" <robh@kernel.org> Link: https://lore.kernel.org/r/20240607173927.26321-4-quic_okukatla@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-13dt-bindings: interconnect: Add MediaTek EMI Interconnect bindingsAngeloGioacchino Del Regno1-0/+51
Add bindings for the MediaTek External Memory Interface Interconnect, which providers support system bandwidth requirements through Dynamic Voltage Frequency Scaling Resource Collector (DVFSRC) hardware. This adds bindings for MediaTek MT8183 and MT8195 SoCs. Note that this is modeled as a subnode of DVFSRC for multiple reasons: - Some SoCs have more than one interconnect on the DVFSRC (and two different kinds of EMI interconnect, and also a SMI interconnect); - Some boards will want to not enable the interconnect driver because some of those are not battery powered (so they just keep the knobs at full thrust from the bootloader and never care scaling busses); - Some DVFSRC interconnect features may depend on firmware. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20240610085735.147134-3-angelogioacchino.delregno@collabora.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29Merge branch 'icc-sm7150' into icc-nextGeorgi Djakov1-0/+84
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsDanila Tikhonov1-0/+84
The Qualcomm SM7150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Danila Tikhonov <danila@jiaxyga.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-26Merge branch 'icc-cleanup' into icc-nextGeorgi Djakov1-1/+1
* icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlate Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-19dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora addressJeffrey Hugo1-1/+1
The servers for the @codeaurora domain have long been retired and any messages sent there will bounce. Fix Odelu's address in the binding to match the .mailmap entry so that folks see the correct address when looking at the documentation. Signed-off-by: Jeffrey Hugo <quic_jhugo@quicinc.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20240202181748.4124411-1-quic_jhugo@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-01-31dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdam Skladowski1-0/+3
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware] Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-15Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov1-0/+1
More QCM2290-related patches to document the bandwidth monitor instance. * icc-qcm2290 dt-bindings: interconnect: qcom,msm8998-bwmon: Add QCM2290 bwmon instance Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-15Merge branch 'icc-sm6115' into icc-nextGeorgi Djakov2-0/+153
Add DT bindings and a driver for managing NoC providers on SM6115. * icc-sm6115 dt-bindings: interconnect: Add Qualcomm SM6115 NoC interconnect: qcom: Add SM6115 interconnect provider driver dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM6115 bwmon instance interconnect: qcom: sm6115: Fix up includes Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-2-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
generated by cgit v1.2.3 (git 2.39.1) at 2026-01-31 15:59:08 +0000